The abandonment of the Huawei Pura highlights chip progress in China

Huawei’s new flagship smartphone, Pura 70 Pro, is equipped with a higher percentage of local components than Mate 60, has an improved Kirin chipset and flash memory produced by domestic suppliers, device research Reuters revealed.

Investigation by iFixit and TechSearch International into the matter Reuters discovered that the flash drive was likely packaged by Huawei’s HiSilicon unit and included additional components made by Chinese companies.

The new device contains a memory chip from South Korea’s SK Hynix, but the NAND chip was likely supplied by HiSilicon, researchers said.

The growing percentage of domestic components and advances in capabilities came despite expanding trade sanctions on Huawei and other Chinese companies aimed at limiting their access to advanced technologies. The US crackdown has emboldened China, which is determined to fill the technology gap with non-Chinese companies to achieve self-sufficiency.

In its latest move against Huawei, the US Department of Commerce has revoked export licenses held by Intel and Qualcomm to supply the companies with chips for smartphones and laptops.

A representative of China’s Ministry of Commerce condemned the new restriction, calling it an abuse of export controls and a “typical act of economic coercion” that violates WTO rules and harms the interests of American companies, Global times reported.

Huawei unveiled the Pura 70 series in April.

The August 2023 launch of the Mate 60 Pro with a Chinese-made processor caused alarm in the US, where the government wanted to introduce new restrictions on local suppliers supporting Huawei.